How Many Microscopies Does It Take to Get to the Root Cause of the Fail? Sample Prep, Imaging, and In-Situ Analysis for Integrated Circuit Failure Analysis at the 14nm Node
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Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Electron and X-Ray Spectroscopy Techniques · VLSI and Analog Circuit Testing
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References (4)
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1. Die-Level Scanning Capacitance Microscopy Fault Isolation on SOI Fin-FET Devices for Advanced Semiconductor Nodes
2. Nanoprobing based EBAC technique from backside as well as frontside to isolate logic fails for otherwise non-visual defects
3. Fault Isolation of MOL and FEOL Buried Defects Using Conductive Atomic Force Microscopy as a Complement to Passive Voltage Contrast Imaging
4. Combined SCM and Nanoprobing Study of Resistive Fails on SOI FinFET Devices