journal article·2018-09

Eliminate the transmission feedthrough of thermal‐piezoresistive I 2 ‐BAR MEMS resonators based on reverse‐biased PN junction

Zhuang Xiong, Zhaoyun Zhang, Li Zhang, He Yang

Micro & Nano Letters· Volume 13· Issue 9
Publisher page

Abstract

The thermally driving and piezo‐resistive sensing I 2 ‐BAR resonators have attracted substantial attentions due to its promising features which could be widely applied for radio frequency) applications. However, one major drawback of the I 2 ‐BAR resonators is that the thermal driving and the piezoresistive sensing signals are highly coupled which results in an excessive transmission feedthrough floor, masking thus the real resonance behaviours. In this work, a simple and effective approach to eliminate the feedthrough effect using reverse‐biased PN junction is presented. The device was fabricated on a p‐type silicon‐on‐insulator wafer with locally doped n‐type regions. With proper bias voltages, the thermal driving current and the output piezoresistive current were confined inside the p‐type layer and the n‐type layer, respectively. With such design concept, an improvement of 50 dB feedthrough reduction was observed comparing with the conventional measurement. The resonance behaviour can thus be physically obtained without further post data processing. This research also shows that such measurement methods can be transferred to other domains where integrated thermal driving and piezoresistive sensing transductions are required.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced MEMS and NEMS Technologies · Acoustic Wave Resonator Technologies · Mechanical and Optical Resonators

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute of Electronic Engineering China Academy of Engineering Physics Mianyang 621999 People's Republic of China

Funding

National Natural Science Foundation of China

References (17)

Show source-provided references
1. 10.3390/s14112066710.3390/s141120667 ↗
2. BontempsJ.J.M.: ‘56 MHZ piezoresistive micromechanical oscillator’.TRANSDUCERS'09 15th Int. Conf. Solid‐State Sensors Actuators and Microsystems Denver CO USA 2009 pp.1433–143610.1109/SENSOR.2009.5285812 ↗
3. 10.1088/0960‐1317/20/12/12501810.1088/0960‐1317/20/12/125018 ↗
4. RahafroozA.PourkamaliS.: ‘Active self‐Q‐enhancement in high frequency thermally actuated M/NEMS resonators’.Micro Electro Mechanical Systems (MEMS2011) Cancun Mexico 2011 vol. 58 no. 4 pp.760–76310.1109/MEMSYS.2011.5734536 ↗
5. 10.1109/TED.2011.210549110.1109/TED.2011.2105491 ↗
6. HallH.J.RahafroozA.BrownJ.J.et al.: ‘Thermally actuated I‐shaped electromechanical VHF resonators’.Micro Electro Mechanical Systems (MEMS2012) Paris France 2012 no. February pp.737–74010.1109/MEMSYS.2012.6170291 ↗
7. 10.1038/micronano.2016.410.1038/micronano.2016.4 ↗
8. 10.1109/JMEMS.2010.205209310.1109/JMEMS.2010.2052093 ↗
9. BeardsleeL.A.LehmannJ.CarronC.et al.: ‘Thermally actuated silicon tuning fork resonators for sensing applications in air’.Micro Electro Mechanical Systems (MEMS2012) Paris France 2012 no. February pp.607–61010.1109/MEMSYS.2012.6170261 ↗
10. 10.1049/mnl.2015.019810.1049/mnl.2015.0198 ↗
11. 10.1049/mnl.2011.071710.1049/mnl.2011.0717 ↗
12. 10.1088/0960‐1317/20/12/12501910.1088/0960‐1317/20/12/125019 ↗
13. 10.1088/0960‐1317/23/3/03501610.1088/0960‐1317/23/3/035016 ↗
14. 10.1109/JMEMS.2011.217901210.1109/JMEMS.2011.2179012 ↗
15. ChenC.‐C.YuH.‐T.LiS.‐S.: ‘A balanced measurement and characterization technique for thermal‐piezoresistive micromechanical resonators’ Micro Electro Mechanical Systems (MEMS2012) Paris France 2012 pp.377–38010.1109/MEMSYS.2012.6170212 ↗
16. ‘ROCKCHIP.’ Available atwww.rock‐chips.com
17. 10.1016/j.cap.2008.03.02410.1016/j.cap.2008.03.024 ↗