Mixed-mode interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
Source abstract
Abstract
Abstract The problem for bonded dissimilar half-planes with a functionally graded interlayer weakened by a pair of two offset interfacial cracks is investigated, within the framework of linear plane elasticity. The Fourier integral transform method is employed and the formulation of the current crack problem is reduced to a system of Cauchy-type singular integral equations. In the numerical results, parametric studies are conducted so that the variations of mixed-mode stress intensity factors vs. offset crack distance are illustrated, elaborating several unique and salient features regarding the singular crack interaction strongly affected by the material and geometric configurations of the bonded system. Further addressed is the quantification of probable cleavage angles for the incipient kinking of the original cracks.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Numerical methods in engineering · Structural Load-Bearing Analysis · Mechanical Behavior of Composites
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