Minimizing Thermal Conductivity for Boosting Thermoelectric Properties of Cu–Ni-Based Alloys through All-Scale Hierarchical Architectures
Abstract
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal properties of materials · Thermal Radiation and Cooling Technologies
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Affiliations
School of Materials Science and Engineering, Shanghai University, 99 Shangda Road, Shanghai 200444, China
Materials Genome Institute, Shanghai University, 99 Shangda Road, Shanghai 200444, China
School of Materials Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China
Guangxi Key Laboratory of Information Materials, Guilin University of Electronic Technology, Guilin 541004, China
Funding
National Natural Science Foundation of China · Programme of Introducting Talents of Discipline to Universities · National Key Research and Development Program of China