In situmeasurement on TSV-Cu deformation with hotplate system based on sheet resistance

The in situ measurement of TSVs deformation at different temperature is meaningful for learning more about the thermal deformation schemes of 3D TSVs in the microelectronic devices. An efficient and smart hotplate based on sheet resistance is designed for offering more heat, producing a uniform temperature distribution, relieving thermal stress and heat concentration issues, and reducing room space, which was optimized by the finite element method (FEM). The fabricated hotplate is efficient and smart (2.5 cm × 2.0 cm × 0.5 cm) enough to be located in the limited space during measuring. The thermal infrared imager was employed as the temperature sensor for monitoring the temperature distribution of TSVs sample. The 3D profilometry was adopted as the observer for TSVs profiles survey. The in situ 2D top surface profiles and 3D displacement profiles of TSVs sample at the different temperature were measured by 3D profilometer. The in situ average relative deformation and effective plastic deformation of the TSV sample were measured. With optical measurement method, 3D profilometry, the TSV sample can be tested repeatedly.