Thermal conductivity and thermal expansion of few-layer h-BN/Cu composites

Abstract Few-layer h-BN/Cu composites are successfully synthesized by solvothermal method and subsequently vacuum hot-pressing sintering process, and the influence of h-BN content on the thermal physics properties of composites is investigated. The thermal conductivity of the composites initially increase with increasing h-BN content, reaching a maximum of 428 W/(m·K) at 6 wt% h-BN. As the content of h-BN content further increased, the thermal conductivity decrease, which can be explained by the anisotropic thermal conductivity of h-BN and its distribution in the composites. The introduction of h-BN reduces the thermal expansion coefficient of the composites because of its low thermal expansion coefficient. These composites have potential applications in the field of electrical packaging.