Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering
Source abstract
Abstract
Abstract Device fabrication using Mg2Si1-xSnx thermoelectric (TE) material for 600–800 K application requires stable and low resistance electrical contacts between TE legs and the electrodes. In this study, n-type Mg2Si0.38Sn0.6Bi0.02 was hot-pressed with Cu electrodes in a single step, resulting in Cu3Mg2Si and Cu4MgSn phases at the interface. Although the specific contact resistance (rc) across the interface was 4.4 ± 0.9 μΩ.cm2, the electrical resistivity of the TE leg increased by approximately 60 % due to Cu diffusion through the interface. Incorporating the SS304 interlayer to prevent Cu diffusion increased rc to 6.1 ± 2 μΩ.cm2. Upon annealing at 723 K for 3–15 days, rc remained at
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal Expansion and Ionic Conductivity · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (43)
Show source-provided references
1. Thermoelectric devices for power generation: recent progress and future challenges10.1002/adem.201500333 ↗
2. Highly effective Mg2Si1-xSnx thermoelectrics10.1103/PhysRevB.74.045207 ↗
3. Influence of power factor enhancement on the thermoelectric figure of merit in Mg2Si0.4Sn0.6 based materials10.1002/pssa.201300196 ↗
4. High thermoelectric performance in Mg2(Si0.3Sn0.7) by enhanced phonon scattering10.1021/acsaem.8b02148 ↗
5. Thermoelectric devices: a review of devices, architectures, and contact optimization
6. Key issues in the development of thermoelectric power generators: high figure-of-merit materials and their highly conducting interfaces with metallic interconnects10.1016/j.enconman.2016.01.065 ↗
7. Highly effective GeNi alloy contact diffusion barrier for BiSbTe long-term thermal exposure10.1021/acsomega.9b00551 ↗
8. Elevated temperature behavior of CuPb18SbTe20/nano-Ag/Cu joints for thermoelectric devices10.1007/s11664-018-6789-1 ↗
9. Contact resistance in spark plasma sintered segmented legs10.1134/S1063782617080097 ↗
10. Study on the interfacial stability of p-type Ti/CeyFexCo4-xSb12 thermoelectric joints at high temperature10.1016/j.jallcom.2016.02.041 ↗
11. Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications10.1039/c3ta13456c ↗
12. Fabrication and characterization of nickel contacts for magnesium silicide based thermoelectric generators10.1016/j.jallcom.2015.01.149 ↗
13. A high-throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules10.1557/jmr.2019.12 ↗
14. Power generation from nanostructured PbTe-based thermoelectrics: comprehensive development from materials to modules10.1039/C5EE02979A ↗
15. Ni barrier in Bi2Te3-based thermoelectric modules for reduced contact resistance and enhanced power generation properties10.1016/j.jallcom.2019.04.293 ↗
16. Liu · 2017 · 605
17. Ni and Ag electrodes for magnesium silicide based thermoelectric generators10.1016/j.mtener.2018.10.016 ↗
18. Contacting Cu electrodes to Mg2Si0.3Sn0.7: direct vs. indirect resistive heating10.1134/S1063782619130025 ↗
19. 2002 · 9
20. Transport and mechanical properties of high-ZT Mg2.08Si0.4−xSn0.6Sbx thermoelectric materials10.1007/s11664-013-2865-8 ↗
21. Developing contacting solutions for Mg2Si1-xSnx based thermoelectric generators: Cu and Ni45Cu55 as potential contacting electrodes10.1021/acsami.9b12474 ↗
22. Desai · 1978
23. Phase diagram determination and thermodynamic modeling of the Cu-Mg-Si system10.2298/JMMB150515009Z ↗
24. Light metal systems. Cu-Mg-Sn (copper - magnesium -Tin)
25. Duration of thermal stability and mechanical properties of Mg2Si/Cu thermoelectric joints10.1007/s11664-018-6091-2 ↗
26. Energetic consideration of the conduction type of Mg2Si doped with Cu, Ag, or Au using first-principle calculations10.1016/j.jallcom.2012.09.026 ↗
27. Chromium oxide reduction from slag by silicon and magnesium10.1002/srin.200506094 ↗
28. Reprint of FactSage thermochemical software and databases10.1016/j.calphad.2016.07.004 ↗
29. Contact resistance studies on thermoelectric materials10.1016/0365-1789(62)90008-5 ↗
30. Application overview of the potential Seebeck microscope
31. High-temperature oxidation of Mg2(Si-Sn)10.1016/j.corsci.2016.05.016 ↗
32. First-principles and experimental studies of impurity doping into Mg2Si10.1016/j.intermet.2007.12.001 ↗
33. Multi-temperature structure of thermoelectric Mg2Si and Mg2Sn10.1107/S2052520617014044 ↗
34. Current progress and future challenges in thermoelectric power generation: from materials to devices10.1016/j.actamat.2014.12.042 ↗
35. Mg2(Si,Sn)- based thermoelectric materials and devices, Ph.D. thesis, Michigan State University
36. Ohmic contacts to SiC10.1142/S0129156405003429 ↗
37. Thermoelectric characteristics of a commercialized Mg2Si source doped with Al, Bi, Ag, and Cu10.1007/s11664-010-1155-y ↗
38. The universal influence of contact resistance on the efficiency of a thermoelectric generator10.1007/s11664-015-3731-7 ↗
39. Vacuum thermionic work functions of polycrystalline Be, Ti, Cr, Fe, Ni, Cu, Pt, and type 304 stainless steel10.1063/1.1708797 ↗
40. Thermoelectric properties of chromium disilicide prepared by mechanical alloying10.1007/s10853-013-7398-2 ↗
41. High temperature thermoelectric properties of p-and n-type β-FeSi2 with some dopants10.1016/S0966-9795(03)00020-7 ↗
42. Contact resistance and stability study for Au, Ti, Hf and Ni contacts on thin-film Mg2Si10.1016/j.jallcom.2016.12.229 ↗
43. Thermal stability of magnesium Silicide/Ni contacts10.1007/s11664-016-4716-x ↗