Preparation of copper nanoparticles on carbon nanotubes by electroless plating method

Abstract Densely distributed copper nanoparticles have been deposited on the surface of carbon nanotubes with a size of ∼10 nm by the electroless plating method. It has been found that the pretreatment of the carbon nanotubes is very important to obtain the copper nanoparticles on the carbon nanotubes; in our experiments, one-step pretreatment of mixed HNO 3 and H 2 SO 4 was found effective. In order to attain nanosized copper particles, the electroless plating parameters should be closely controlled; e.g., the pH value of the plating solution, the temperature, and the concentration and titrating speed of HCOH were critical.