DataVXMaterials Research BulletinPaper
journal article·2003-03

An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

S Murali, N Srikanth, Charles J Vath

Materials Research Bulletin· Volume 38· Issue 4
Publisher page
Source abstract

Abstract

Abstract In IC packages, thermosonic wire bonding is the preferred method for making electrical connections between the die pad and lead frame. These interconnect are made using fine metal wires. On thermal aging (under 175 °C for 5 h) gold aluminide easily forms in gold ball bonds while formation of intermetallic compound is absent in case of copper ball bonds. An analysis of the atomic property of the elements bonded explains that atomic radii and electronegativity factors favor gold aluminide formation.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (13)

Show source-provided references
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