High-strength high-thermal-conductivity pure tungsten by HOP

Pure tungsten was prepared by vacuum oscillatory hot pressing. After vacuum powder forging, bending strength increased from 394 MPa to 925 MPa, and thermal conductivity at room temperature improved from 149.1 to 173.5 W·m−1·K−1. Relative density and grain size were also optimized. The as-sintered fracture showed transgranular cleavage with “rock candy” patterns, while forged samples exhibited mixed fracture modes. The process promotes grain deformation, strengthens grain boundaries, and induces dynamic recrystallization, enabling grain refinement and plastic deformation. This method enhances the properties of powder-metallurgy pure tungsten for broader applications.