journal article·2026-10

Study of the interface microstructure of silver-plated copper-clad aluminum wire

Jiahui Zhang, Yu Wang, Kai Zhao, Shuai Pan, Yanqiang Li, Huijun Kang, Enyu Guo, Jingwei Xian, Zongning Chen, Qingling Bai, Ying Fu, Changlong Yang, Tongmin Wang

Materials Letters· Volume 420
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OpenAlex topics: Copper Interconnects and Reliability · Microstructure and mechanical properties · Metallurgical and Alloy Processes

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