Research of growth kinetics of Cu/Sn intermetallic compounds in planar and curved Cu/Sn diffusion couples
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Thermodynamic and Structural Properties of Metals and Alloys
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References (9)
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1. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process10.1016/j.actamat.2010.10.053 ↗
2. Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and cu substrate10.1016/j.mee.2011.04.034 ↗
3. A novel method for fabricating dual-continuous pore-ligament porous copper and application in power device packaging10.1016/j.matlet.2025.140005 ↗
4. Study on the interfacial reactions for ag/Sn/cu TLP during transient liquid phase soldering process10.1007/s10854-025-14343-8 ↗
5. M. Shang, C. Dong, H. Ma et al., Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented cu substrates, J. Mater. Sci. Mater. Electron. 36(5) (2022) 2957–2969, doi:https://doi.org/10.1007/s10854-021-07494-x.10.1007/s10854-021-07494-x ↗
6. Kinetics of Cu6Sn5 and Cu3Sn intermetallic compounds growth and isothermal solidification during cu-Sn transient liquid phase sintering process10.1016/j.jallcom.2023.169631 ↗
7. Effect of joint size on microstructure and growth kinetics of intermetallic compounds in solid-liquid interdiffusion Sn3.5Ag/Cu-substrate solder joints10.1115/1.4023846 ↗
8. Gibbs-Thomson effect as driving force for liquid film migration: converting metallic into ceramic fibers through intrinsic oxidation10.1016/j.actamat.2021.117216 ↗
9. Gibbs–Thomson effects in phase transformations10.1016/j.scriptamat.2004.12.026 ↗