article·2026-04-10

Study on the microstructure evolution, microhardness and fracture behavior of laser welded hypereutectic Al-Si alloy for electronic packaging

Wenbin Tian, Beilin Ouyang, Rong Zeng, Yuanpeng Li, Yaning Lin, Xiangyang Shi, Jie Ning

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OpenAlex topics: Advanced Welding Techniques Analysis · Electronic Packaging and Soldering Technologies · Microstructure and mechanical properties

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