Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging
Source abstract
Abstract
Severe thermal mismatch arising from frequent start-stop cycling of power devices induces periodic shear stress at the bondline, rendering conventional Sn-3Ag-0.5Cu (SAC305) solder-based bondlines susceptible to cracking under temperature shock loading. Herein, a novel interconnect material based on porous copper filled SAC305 was proposed. After 1200 temperature shock cycles, the bondline fabricated with porous Cu filled SAC305 exhibited a crack propagation rate of merely 36.4%, while its shear strength decreased from 45.6 MPa to 25.8 MPa. The results confirm that the porous Cu-filled SAC305 interconnect material possesses excellent temperature shock resistance, making it a promising candidate for high-reliability power device packaging.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Cellular and Composite Structures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (13)
Show source-provided references
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