The influence of pressure on the interface reaction and the joint shear strength of the Co P/Sn system fabricated by transient liquid phase bonding
Source abstract
Abstract
Full CoSn 3 solder joints were successfully fabricated via transient liquid phase bonding (TLPB) with controllable soldering parameters. The influence of pressure on the joint was investigated. The microstructure and shear strength of the joint were characterized and tested. Under a pressure of 1–4 MPa, the isothermal solidification process was completed, and a single CoSn 3 intermetallic compound (IMC) was formed in the joint area. With the increase of soldering pressure, the shear strength of the soldering joint increased from 26.44 MPa to 60.16 MPa. This paper shows that the full CoSn 3 IMC joints fabricated by the TLPB process possess the advantages of low-temperature soldering and high-temperature serviceability, meeting the high-temperature service requirements of future power devices.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electrical Contact Performance and Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (14)
Show source-provided references
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