Wetting confined conformal soldering for large-scale interconnection through AgNW aerogel composite preform
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electrical Contact Performance and Analysis
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References (9)
Show source-provided references
1. Thermal fatigue life of ceramic based BGA solder joints after reflux warping
2. Study on leadframe overflow prevention of soldering paste using fluid-structure coupling analysis
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4. Effect of nanoparticles addition on the microstructure and properties of lead-free solders: a review10.3390/app9102044 ↗
5. Solderability of SnBi-nano cu solder pastes and microstructure of the solder joints[J]10.1007/s10854-015-4016-x ↗
6. Development and characterization of Sn99Ag0.3Cu0.7-(ZrO2/CuO/TiO2) Nano-composite solder alloys[C]//2024 Pan Pacific strategic electronics symposium (Pan Pacific)
7. Comparing the Solderability of different SAC0307 composite solder pastes[C]//2023 24th European microelectronics and packaging Conference & Exhibition (EMPC)
8. Application of ZnO nanoparticles in Sn99Ag0.3Cu0.7 based composite solder alloys10.3390/nano11061545 ↗
9. Interfacial reactions between in and ag during solid liquid interdiffusion process