Modified galvanic replacement using ethanol vapor-assisted vacuum ultraviolet (E-VUV) for enhanced Ag deposition
Source abstract
Abstract
To enhance the Ag coverage on the Cu surface in the galvanic replacement (GR) method, a two-step surface treatment was developed using Ar fast atom beam (Ar-FAB) bombardment followed by ethanol vapor-assisted vacuum ultraviolet (E-VUV) irradiation. Ar-FAB removed the native oxide from Cu, and E-VUV formed a protective layer that prevents Cu reoxidation in air and dissolves readily in AgNO 3 solution. Compared to the traditional GR method with acid etching, X-ray photoelectron spectroscopy (XPS) analyses showed an increased spectrum intensity in Ag 3d and a decrease in Cu-O and –OH, indicating better coverage of the Ag layer on the Cu surface. The Ag layer thickness grew by about 7 nm during immersion from 10 to 300 s, while the traditional GR film stopped growing after 60 s. Scanning electron microscopy (SEM) revealed minimal growth of large Ag dendrites
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (13)
Show source-provided references
1. Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding10.1038/s41598-020-78396-x ↗
2. Achieving low-temperature Cu-Cu bonding platform via area-selective metal films with superior surface roughness for advanced packaging10.1016/j.jmrt.2025.05.041 ↗
3. Thin film deposition methods: a critical review10.22214/ijraset.2021.36154 ↗
4. A ligand oxidation structure-adaptive strategy for copper passivation
5. Surface modification of Cu native oxide: Ag displacement for homogeneous layering
6. Organic-inorganic solid-state hybridization with high-strength and anti-hydrolysis interface
7. A. Shigetou, “Surface Modification for High Reliability and Reversible Hybrid Interconnection,” Poster in 2025 Japan-America Frontiers of Engineering Symposium (poster only), 2025/06/02, San Diego, US.
8. Improved galvanic replacement growth of Ag microstructures on Cu micro-grid for enhanced SERS detection of organic molecules
9. A.V. Naumkin, et al., NIST X-ray photoelectron spectroscopy database, 2008.
10. Preparation and anti-oxidation resistance of silver-coated copper powders by cobalt-modified copper powders
11. The kinetics of precipitation from supersaturated solid solutions
12. Understanding the nanoscale phenomena of nucleation and crystal growth in electrodeposition10.1039/D4NR02389G ↗
13. Low-temperature direct hybrid bonding of polypropylene to natural rubber and Cu by MG-VUV method without vacuum10.1016/j.matlet.2022.132499 ↗