Fabrication of multicomponent copolymer-derived fluorocarbon resin toward ultra-low dielectric loss
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Research context
OpenAlex topics: Synthesis and properties of polymers · Epoxy Resin Curing Processes · Silicone and Siloxane Chemistry
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References (5)
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1. High-frequency 5G substrate: low dielectric biphenyl polyimide with low CTE and high thermal stability
2. Synthesis and characterizations of polystyrene materials with low dielectric constant and low dielectric loss at high frequency10.1002/app.54012 ↗
3. Progress on polymer composites with low dielectric constant and low dielectric loss for high-frequency signal transmission10.3389/fmats.2021.774843 ↗
4. Low dielectric polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high‐frequency flexible circuit board application10.1002/mame.202100086 ↗
5. Design and preparation of benzoxazine resin with high-frequency low dielectric constants and ultralow dielectric losses10.1021/acsapm.8b00083 ↗