A simple silanization pretreatment to effectively inhibit the lateral growth of nickel electrodeposits for multilayer chip inductors
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OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · GaN-based semiconductor devices and materials
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References (8)
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7. Yang · Corros. Sci. · 2020 · 177
8. Yang · Mater. Lett. · 2024 · 37210.1016/j.matlet.2024.137054 ↗