journal article·2025-09

Significant enhancement of the comprehensive performance of electrically conductive adhesives using silver halides

Junhao Liu, Yankang Han, Xuecheng Yu, Hebin Zhang, Gang Li, Rong Sun, Pengli Zhu

Materials Letters· Volume 395
Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (12)

Show source-provided references
1. Reduced percolation threshold of conductive adhesive through nonuniform filler localization: Monte Carlo simulation and experimental study10.1016/j.compscitech.2021.108964 ↗
2. Isotropic conductive paste for bioresorbable electronics
3. Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterization10.3390/mi13081240 ↗
4. Printed electrically conductive composites: conductive filler designs and surface engineering10.1039/c3tc00572k ↗
5. Property prediction of ag-filled isotropic conductive adhesive through the analysis of its curing and decomposition kinetics10.3390/catal12020185 ↗
6. Y.i. Li, Kyoung-Sik Moon, C.P. Wong, Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids, IEEE Trans. Compon., Packag. Technol. 29 (2006) 173-178 10.1109/TCAPT.2006.870388.10.1109/TCAPT.2006.870388 ↗
7. Silver surface iodination for enhancing the conductivity of conductive composites10.1002/adfm.201000673 ↗
8. S. Wang, Z. Zhou, A. Goulas, G.W. Critchlow, D.C. Whalley, D.A. Hutt, The role of self-assembled monolayers in the surface modification and interfacial contact of copper fillers in electrically conductive adhesives, ACS Appl. Mater. Interf. 16 (2023) 1846–1860.https://doi.org/10.1021/acsami.3c14900.10.1021/acsami.3c14900 ↗
9. Ternary Ag/epoxy adhesive with excellent overall performance10.1021/acsami.5b00470 ↗
10. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes10.1109/TCAPT.2006.885940 ↗
11. A novel temperature-dependent percolation model for the electrical conductivity and piezoresistive sensitivity of carbon nanotube-filled nanocomposites10.1016/j.actamat.2022.117870 ↗
12. Breadth-first search algorithm on the finite element simulation of the electrical resistivity of the carbon black elastomeric pressurized sensor10.1016/j.compositesa.2024.108523 ↗