Effects of grain boundary geometry on rotation-induced Sn whisker formation during thermal cycling
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Forming · Metal Forming Simulation Techniques
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References (14)
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1. NASA. Whisker Failures. https://nepp.nasa.gov/whisker/failures/index.htm.
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4. Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films10.1016/j.matlet.2013.02.066 ↗
5. Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction10.1016/j.actamat.2019.02.021 ↗
6. Whisker and hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits10.1016/j.actamat.2005.07.016 ↗
7. Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films10.1016/j.scriptamat.2020.06.033 ↗
8. Whisker Nucleation by Slip-Assisted Grain Rotation During Thermal Cycling10.1007/s11837-023-06366-5 ↗
9. Transformation of ∑17 special tilt boundaries to general boundaries in tin10.1016/0001-6160(88)90225-8 ↗
10. Whisker and hillock growth via coupled localized coble creep, grain boundary sliding, and shear induced grain boundary migration10.1016/j.actamat.2012.12.019 ↗
11. Shallow grain formation in Sn thin films10.1016/j.actamat.2020.03.014 ↗
12. Crystal plasticity FEM study of nanoindentation behaviors of Cu bicrystals and Cu–Al bicrystals10.1557/jmr.2015.223 ↗
13. Scaling of microstructural parameters: Misorientations of deformation induced boundaries10.1016/S1359-6454(96)00153-X ↗
14. Chemo-thermo-mechanically coupled crystal plasticity simulation ofstress evolution in thermally strained β-Sn films10.1007/s11664-018-6733-4 ↗