Study of the strengthening mechanism of electrodeposited Ni-B thin films with ultra-low boron content

Abstract In this study, the hardening behavior of Ni-B thin films with ultra-low boron contents is investigated by synchrotron X-ray diffraction and high resolution transmission electron microscope (HR-TEM). The hardness of Ni-B thin films increases with an increase of boron content within films, the highest hardness is approximately at 1120 Hv. average grain size about 4.64 nm. The analysis of synchrotron X-ray diffraction and HR-TEM indicated the strengthening mechanism of Ni-B thin films can be attributed to a combined effect of solid solution strengthening and fine grain strengthening mechanisms.