High thermal conductivity diamond-doped silver paste for power electronics packaging
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Thermal properties of materials · Aluminum Alloys Composites Properties
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References (11)
Show source-provided references
1. The effect of temperature on the reliability of electronic components
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6. Thermal conductivity of the elements10.1063/1.3253100 ↗
7. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix10.1007/s10853-010-4938-x ↗
8. Thermal properties of diamond/Ag composites fabricated by eletroless silver plating10.1016/j.diamond.2010.11.017 ↗
9. Processing of diamond-particle-dispersed silver-matrix composites in solid–liquid co-existent state by SPS and their thermal conductivity10.1016/j.compositesb.2011.08.003 ↗
10. Low-pressure-assisted large-area (>800 mm2) sintered-silver bonding for high-power electronic packaging10.1109/TCPMT.2017.2773100 ↗
11. Effect of the pore shape on the thermal conductivity of porous media10.1007/s10853-012-6616-7 ↗