Binder system for micropowder injection molding
Source abstract
Abstract
Abstract To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Injection Molding Process and Properties · Advanced machining processes and optimization · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
Show source-provided references
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