ULTRASONIC SIGNAL-PROCESSING CONCEPTS FOR MEASURING THE THICKNESS OF THIN LAYERS
Source abstract
Abstract
A systematic approach is presented for developing ultrasonic signal-processing procedures that can be used to measure the thickness of thin layers. Such preprocessing procedures as time between echoes, peak-to-peak amplitude analysis, and Fourier Transform techniques are considered in the paper. The work can be extended to such areas of study as the property evaluation of thin planar defects in metals, flaw characterization analysis in an adhasively bonded system, and also applied to the fatigue crack analysis problem, including an evaluation of possible corrosion and sealer properties in the thin layer. /Author/
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Ultrasonics and Acoustic Wave Propagation · Non-Destructive Testing Techniques · Thermography and Photoacoustic Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.