Quantifying delamination energy in tungsten on silicon thin films through nanoindentation and nanoscratch
Source abstract
Abstract
Quantifying delamination energy is crucial for the reliability and longevity of thin films. In this work, the delamination energy in tungsten-silicon thin films is investigated through nanoindentation and nanoscratching. Nanoindentation was also employed to assess the mechanical properties of the coating through the use of substrate corrections. Energy methods were used to analyse the nanoindentation load displacement curves to quantify the delamination energy. Finite element modelling was used to further improve the accuracy of the calculated delamination energy. Nanoscratching was found to be highly sensitive to the scratch parameters used, and the effect of scratch parameters on the critical load and delamination energy was investigated. It was found that the presence of fragmentation event in nanoscratching led to higher delamination energy values as compared to nanoindentation. Nanoindentation was found to output values closer to that of literature and were additionally not parameter sensitive, making it a reliable method of evaluating thin film adhesion.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and devices · High-Temperature Coating Behaviors
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (54)
Show source-provided references
1. years of N-heteropentacenes as semiconductors for organic thin-film transistors10.1002/adma.201305497 ↗
2. Thin-Film Coating Methods: A Successful Marriage of High-Quality and Cost-Effectiveness—A Brief Exploration10.3390/coatings12081115 ↗
3. Solid state thin-film lithium battery systems10.1016/S1359-0286(99)00052-2 ↗
4. Bendable inorganic thin-film battery for fully flexible electronic systems10.1021/nl302254v ↗
5. DLC thin films for implantable medical devices
6. Thin film solar cells: Research in an industrial perspective10.1007/s13280-012-0265-6 ↗
7. Current status, challenges, and future prospects of thin film coating techniques and coating structures
8. Stresses in thin films: an experimental study10.1007/s12648-018-1281-6 ↗
9. Work of adhesion: Contact angles and contact mechanics10.1016/0143-7496(95)00034-8 ↗
10. Adhesion Measurement of Thin Films
11. Quantitative peel test for thin films/layers based on a coupled parametric and statistical study10.1038/s41598-019-55355-9 ↗
12. Determination of adhesion energy of cnx thin film on silicon from micro-scratch testing10.1080/05698190490278930 ↗
13. Microscratch testing to characterize the adhesion of thin layers10.1016/0257-8972(91)90121-C ↗
14. Panich · 2006
15. Addressing Fracture Properties of Individual Constituents Within a Cu-WTi-SiOx-Si Multilayer10.1007/s11837-020-04444-6 ↗
16. The influence of chemistry on the interface toughness in a WTi-Cu system10.1016/j.actamat.2022.117813 ↗
17. Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination10.1063/1.333794 ↗
18. Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W10.1557/JMR.1999.0405 ↗
19. Evaluation of the interfacial strength of layered structures by indentation method10.1115/1.2839890 ↗
20. Film Thickness Dependency of Interfacial Strength Evaluation for Thin Film Coating Structure by Nanoindentation Method10.1299/jmmp.4.771 ↗
21. Evaluation of interfacial strength of multilayer thin films polymer by nanoindentation technique
22. Energy dissipation, fracture toughness and the indentation load □ displacement curve of coated materials10.1016/S0257-8972(00)00906-3 ↗
23. Measurement of fracture toughness of ultra-thin amorphous carbon films10.1016/S0040-6090(97)00788-8 ↗
24. Indentation fracture and toughness assessment for thin optical coatings on glass10.1088/0022-3727/40/18/S01 ↗
25. Measurement of adhesion of thin films10.1098/rspa.1960.0012 ↗
26. An energy approach to the adhesion of coatings using the scratch test10.1016/0040-6090(84)90354-7 ↗
27. Interfacial adhesion and friction of pyrolytic carbon thin films on silicon substrates10.1557/JMR.2008.0339 ↗
28. Organic ultrathin film adhesion on compliant substrate using scratch test technique10.1016/j.tsf.2012.07.138 ↗
29. Nanoindentation and nanoscratch of sub-micron polymer nanocomposite films on compliant substrate10.1016/j.tsf.2021.138905 ↗
30. Mechanical properties and interfacial adhesion of composite membranes probed by in-situ nano-indentation/scratch technique10.1016/j.memsci.2015.05.076 ↗
31. Analyses of interface adhesion between porous SiOCH low-k film and SiCN layers by nanoindentation and nanoscratch tests10.1016/j.tsf.2007.07.043 ↗
32. Fracture toughness and adhesion energy of sol-gel coatings on glass10.1557/JMR.2002.0032 ↗
33. On the friction behaviour in nanoscratch testing10.1016/j.wear.2006.01.036 ↗
34. Accurate measurement of thin film mechanical properties using nanoindentation10.1557/s43578-022-00541-1 ↗
35. The dynamical mechanical properties of tungsten under compression at working temperature range of divertors10.1016/j.jnucmat.2015.11.045 ↗
36. Methods for improving ductility of tungsten - A review10.1016/j.ijrmhm.2018.04.012 ↗
37. Nano-Indentation Hardness and Strain Hardening of Silicon, Sodium Chloride and Tungsten Crystals10.1007/s11340-021-00777-8 ↗
38. Effects of the substrate on the determination of thin film mechanical properties by nanoindentation10.1016/S1359-6454(01)00328-7 ↗
39. Microwedge indentation of the thin film fine line – II. Experiment10.1016/1359-6454(95)00430-0 ↗
40. Effect of Rhenium addition on tungsten heavy alloys processed through spark plasma sintering10.1016/j.asej.2021.02.022 ↗
41. Substrate effects on nanoindentation mechanical property measurement of soft films on hard substrates10.1557/JMR.1999.0042 ↗
42. High temperature nano-indentation of tungsten: Modelling and experimental validation10.1016/j.msea.2018.11.079 ↗
43. Hertzberg · 2013
44. Microstructure and indentation response of TiN coatings: The effect of measurement method10.1016/j.tsf.2019.137452 ↗
45. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments10.1557/JMR.1992.1564 ↗
46. New Insights into Nanoindentation-Based Adhesion Testing10.1007/s11837-017-2496-2 ↗
47. Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices10.1021/acsanm.0c02182 ↗
48. Investigation of a new fracture mechanics specimen for thin film adhesion measurement10.1557/JMR.1997.0357 ↗
49. Nanoscratch characteristics and interfacial adhesion energy of SiN/GaAs film/substrate bilayer systems10.1504/IJSURFSE.2013.057618 ↗
50. Failure mode maps in the thin film scratch adhesion test10.1016/S0301-679X(97)00012-1 ↗
51. Adhesion testing by the scratch test method: The influence of intrinsic and extrinsic parameters on the critical load10.1016/0040-6090(87)90377-4 ↗
52. Effect of Adhesion , Film Thickness , and Substrate Hardness on the Scratch Behavior of Poly (carbonate) Films10.1080/00218460590944954 ↗
53. The Scratch Adhesion Test: An Elastic-Plastic Indentation Analysis10.1016/0040-6090(88)90006-5 ↗
54. Experimental and numerical investigation on the effect of scratch direction on material removal and friction characteristic in BK7 scratching