journal article·2019-01Open access

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Chuantong Chen, Katsuaki Suganuma

Materials & Design· Volume 162

Abstract

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of various Ag particles of a flake shape and spherical shape from nano to micro size. Microscale pillar specimens were fabricated by a focused ion beam process and the mechanical properties of the sintered Ag, were measured by micro-compression testing using a nano-indentation system. The microstructure of sintered Ag is dependent upon the size and the shape of the utilized Ag particles, as this significantly influences its fracture behavior and mechanical properties. Mechanical properties not only depend on the porosity of the sintered Ag, but also on the degree of necking growth of the Ag particles. To explore this further, the shear strength of Ag sinter joint using different sizes and shapes of Ag particles was also evaluated. This revealed that sintered Ag flake particles possess a much greater bonding strength above 30 MPa than do sintered Ag spherical shape particles from nano to micro sizes. TEM observation revealed that many nanoparticles with a size less than 10 nm were formed in the sintered Ag flake structure due to its high grain boundary density and dislocation density, which increased its grain bonding quality. Keywords: Ag sinter joint, Nanoparticles, Micro-compression test, Mechanical properties, Die attach modules
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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Powder Metallurgy Techniques and Materials

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References (62)

Show source-provided references
1. Survey of high-temperature reliability of power electronics packaging components10.1109/TPEL.2014.2357836 ↗
2. State of the art of high temperature power electronics10.1016/j.mseb.2010.10.003 ↗
3. Die attach materials for high temperature applications: a review10.1109/TCPMT.2010.2100432 ↗
4. Metal-metal bonding using Ag metallo-organic nanoparticles10.1016/j.actamat.2005.01.047 ↗
5. In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste10.1016/j.jallcom.2016.11.225 ↗
6. Die-attaching silver paste based on a novel solvent for high-power semiconductor devices10.1007/s10853-015-9659-8 ↗
7. Thermal stability of silver paste sintering on coated copper and aluminum substrates10.1007/s11664-017-5857-2 ↗
8. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging10.1016/j.scriptamat.2013.08.031 ↗
9. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging10.1016/j.scriptamat.2012.01.007 ↗
10. Lead-free solders in microelectronics10.1016/S0927-796X(00)00010-3 ↗
11. Advances in lead-free electronics soldering10.1016/S1359-0286(00)00036-X ↗
12. Creep behavior of eutectic 80au/20sn solder alloy10.1016/j.jallcom.2008.09.009 ↗
13. Low-temperature low-pressure die attach with hybrid silver particle10.1016/j.microrel.2011.07.088 ↗
14. Self-healing of cracks in Ag joining layer for die-attachment in power devices10.1063/1.4962333 ↗
15. Mechanical deformation of sintered porous ag die attach at high temperature and its size effect for wide-bandgap power device design10.1007/s11664-016-5200-3 ↗
16. Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure10.1016/j.microrel.2018.07.044 ↗
17. Ageing sintered silver: relationship between tensile behavior, mechanical properties and the nanoporous structure evolution10.1016/j.msea.2016.05.108 ↗
18. Deformation behavior of sintered nanocrystalline silver layers10.1016/j.actamat.2015.06.040 ↗
19. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C10.1016/j.jallcom.2016.06.132 ↗
20. Are sintered silver joints ready for use as interconnect material in microelectronic packaging?10.1007/s11664-013-2967-3 ↗
21. Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study10.1115/1.4033069 ↗
22. Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints10.1016/j.jmatprotec.2015.03.037 ↗
23. Mechanical properties of sintered ag as a new material for die bonding: influence of the density10.1007/s11664-014-3458-x ↗
24. Ageing sintered silver: relationship between tensile behavior, mechanical properties and the nano porous structure evolution10.1016/j.msea.2016.05.108 ↗
25. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices10.1016/j.actamat.2017.02.065 ↗
26. Size dependence in mechanical properties of gold at the micron scale in the absence of strain gradients10.1016/j.actamat.2004.12.031 ↗
27. Transition from a strong-yet-brittle to a stronger-and-ductile state by size reduction of metallic glasses10.1038/nmat2622 ↗
28. Microscale characterization of mechanical properties10.1146/annurev.matsci.36.062705.134551 ↗
29. An analysis of nanoindentation in linearly elastic solids10.1016/j.ijsolstr.2008.07.021 ↗
30. Measurement of hardness and elastic modulus by instrumented indentation: advances in understanding and refinements to methodology10.1557/jmr.2004.19.1.3 ↗
31. Nanoindentation investigation on the initiation of yield point phenomenon in a medium Mn steel10.1016/j.scriptamat.2018.03.015 ↗
32. Bulk and microscale compressive properties of a Pd-based metallic glass10.1016/j.scriptamat.2007.05.025 ↗
33. Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression10.1016/j.actamat.2016.08.030 ↗
34. Size effects on the mechanical behavior of nanoporous Au10.1021/nl061978i ↗
35. Chen · 2017 · 97
36. Low-temperature sintering of nanoscale silver paste for attaching large-area chips10.1109/TCAPT.2009.2021256 ↗
37. Mechanical properties of nano-silver joints as die attach materials10.1016/j.jallcom.2011.10.092 ↗
38. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles10.1016/j.jmatprotec.2014.08.002 ↗
39. High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device10.1007/s10854-018-8903-9 ↗
40. Self-diffusion in sintering of metallic particles
41. The mechanism of densification during sintering of metallic particles10.1016/0001-6160(56)90110-9 ↗
42. Microstructurally based cross-slip mefchanisms and their effects on dislocation microstructure evolution in fcc crystals10.1016/j.actamat.2014.10.067 ↗
43. Work hardening in micropillar compression: in situ experiments and modeling10.1016/j.actamat.2011.03.003 ↗
44. Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material10.1109/TCAPT.2005.853167 ↗
45. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment10.1016/j.matdes.2009.04.006 ↗
46. Tensile behaviors and ratcheting effects of partially sintered chip-attachment films of a nanoscale silver paste10.1007/s11664-008-0516-2 ↗
47. Silver nanosintering: a lead-free alternative to soldering10.1007/s00339-008-4807-5 ↗
48. Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles10.1016/j.matlet.2012.06.089 ↗
49. Joining of silver nanomaterials at low temperatures: processes, properties, and applications10.1021/acsami.5b02134 ↗
50. Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal Interface material applications10.1021/acsami.5b01341 ↗
51. Deep crystallization induced high thermal conductivity of low-temperature sintered Ag nanoparticles10.1016/j.matlet.2013.11.030 ↗
52. High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates10.1007/s10854-017-8087-8 ↗
53. Adsorption and UV/visible photocatalytic performance of BiOI for methyl orange, Rhodamine B and methylene blue: Ag and Ti-loading effects10.1039/C3CE42654H ↗
54. The role of pH on the particle size and magnetic consequence of cobalt ferrite10.1016/j.jmmm.2015.08.022 ↗
55. Nano-volcanic eruption of silver
56. Bonding technology based on solid porous Ag for large area chip10.1016/j.scriptamat.2017.11.035 ↗
57. Softening of nanocrystalline metals at very small grain sizes10.1038/35328 ↗
58. Microscopic description of plasticity in computer generated metallic nanophase samples: a comparison between Cu and Ni10.1016/S1359-6454(99)00109-3 ↗
59. Deformation in nanocrystalline metals10.1016/S1369-7021(06)71494-8 ↗
60. Dislocation propagation versus dislocation nucleation10.1038/nmat1764b ↗
61. Dislocation nucleation from symmetric tilt grain boundaries in body-centered cubic vanadium10.1016/j.physleta.2018.03.002 ↗
62. Length-scale effects in the nucleation of extended dislocations in nanocrystalline al by molecular-dynamics simulation10.1016/S1359-6454(01)00167-7 ↗