Three-Dimensional Metallic Microstructures Fabricated by Soft Lithography and Microelectrodeposition
Source abstract
Abstract
Soft lithography offers a convenient set of methods for the transfer of patterns to planar and nonplanar substrates. Microelectrodeposition can transform thin metal patterns into self-supporting microstructures, weld components together, and strengthen microstructures after deformations. Together, soft lithography and electrochemistry provide synergistic technologies and the basis for a strategy for converting planar patterns into three-dimensional (3D) microstructures with complex topologies. This strategy is illustrated in the formation of folded tetrahedra, square-based pyramids, cylinders with joints, “pop-up” cubes, and linked chains and knots.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanofabrication and Lithography Techniques · Advanced Materials and Mechanics · Modular Robots and Swarm Intelligence
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemistry and Chemical Biology, Harvard University, 12 Oxford Street, Cambridge, Massachusetts 02138, Department of Physics, Harvard University, 9 Oxford Street, Cambridge, Massachusetts 02138, and School of Computer Science, McGill University, 3480 University #318, Montreal PQ H3A 2A7, Canada
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