journal article·2019-06-11

Investigation of Electromagnetic Resonance Rewarming Enhanced by Magnetic Nanoparticles for Cryopreservation

Jiaji Pan, Shen Ren, Praveen K. Sekar, Ji Peng, Zhiquan Shu, Gang Zhao, Weiping Ding, Ming Chen, Dayong Gao

Langmuir· Volume 35· Issue 23
Publisher page

Abstract

The lack of an effective rewarming technique restricted the successful cryopreservation of organ or large tissues by vitrification. The conversion of electromagnetic (EM) energy into heat provides a possible solution for the rewarming process for the cryopreservation. In this work, an EM resonance rewarming system was set up with dynamic feedback control and power feeding optimization. In addition, we take advantage of magnetic nanoparticles (MNPs) to absorb magnetic field energy to further enhance the energy conversion efficiency. We achieved a >200 °C min–1 rewarming rate for tens of milliliters of cryopreserved samples. Besides, we also investigated the effect of nanoparticle size and concentration based on thermal properties by analyzing the contribution of nanoparticles and the utilization of field energy. The closed system reduced the possible concomitant side effects when increasing the number of nanoparticles or increasing the EM source power. With the remarkably low dosage of nanoparticles (0.1 mg mL–1 Fe) compared to that for other MNP-based rewarming applications, this study opens the door to new approaches for exploring novel techniques for tissue and organ preservation.
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Research context

OpenAlex topics: Reproductive Biology and Fertility · Microfluidic and Bio-sensing Technologies · Tissue Engineering and Regenerative Medicine

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Center for Cryo-Biomedical Engineering and Artificial Organs, Department of Mechanical Engineering, University of Washington, Seattle, Washington 98195, United States

School of Engineering and Design, Hunan Normal University, Changsha, China 410081

School of Mechanical and Materials Engineering, Washington State University, Everett, Washington 98201, United States

Department of Electronic Science and Technology, University of Science and Technology of China, Anhui 230027, China

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