Source abstract
Abstract
The effect of doping on the thermoelectric properties of Half-Heusler (HH) high-entropy alloy (HEA) Ti 2 NiCoSnSb was studied. Lower thermal conductivity was observed with increased Sb doping. Mass scattering by heavy (Ta, Zr) and light (Al) dopants was studied to further lower the thermal conductivity. Dopants at the level of up to 50% at the Ti site were studied. A high HH phase content was obtained in the Zr-doped samples, and a low-lattice thermal conductivity of 1.9 W/(m·K) was observed. This value is one of the lowest reported lattice thermal conductivities in HH alloys. The poor solubility of Ta led to undissolved Ta in the samples, which enhanced the electrical properties. In the case of Al doping, the NiAl phase raised the power factor value of Ti 1.8 Al 0.2 NiCoSn 0.5 Sb 1.5 to 2.2 × 10 –3 W/(m·K 2 ), which is almost twice the corresponding value reported for Ti 2 NiCoSnSb. Interestingly, a maximum ZT of 0.29 was found in all of the doped systems, although the transport mechanism and microstructure varied widely with the type of dopant. An optimum dopant level of 25% of Zr, 7.5% of Ta, and 10% of Al is necessary to obtain the maximum ZT in these alloys. Compared to HH systems, the HH high-entropy alloy (HEA) systems provide a larger composition field for tuning the transport properties by simultaneous doping of multiple elements to lower the thermal conductivity.
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Affiliations
Department of Metallurgical and Materials Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu 600036, India
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798
International Advanced Research Centre for Powder Metallurgy and New Materials, Chennai, Tamil Nadu 600113, India
Institute of Materials Research and Engineering, Agency for Science, Technology and Research, 2 Fusionopolis Way, Innovis, #08-03, Singapore 138634
Indian Institute of Technology Hyderabad, Kandi, Telangana 502285, India
Funding
Institute of Materials Research and Engineering