journal article·2018-04-23Open access

Regular Dimpled Nickel Surfaces for Improved Efficiency of the Oxygen Evolution Reaction

Audrey K. Taylor, Irene Andreu, Byron D. Gates

ACS Applied Energy Materials· Volume 1· Issue 4

Abstract

Persistent bubble accumulation during the oxygen evolution reaction (OER) can effectively block catalytically active surface sites and reduce overall system performance. The OER is an essential half-reaction with relevance to metal–air batteries, fuel cells, and water electrolysis for power to gas applications. The renewable energy sector could benefit from the identification of surface morphologies that can effectively reduce the accumulation of bubbles on electrocatalytic surfaces. In this work, regular dimpled nickel (Ni) features were prepared to investigate how electrode morphology and therefore its roughness and wetting properties may affect the efficiency of the OER. The dimpled Ni features were prepared using spherical poly(styrene) (PS) templates with a diameter of 1 μm. The electrodeposition against regular, self-assembled arrays of PS templates was tuned to produce four types of dimpled features each with a different depth. Enhancements to the OER efficiency were observed for some types of dimpled Ni features when compared to a planar electrodeposited Ni electrode, while the dimpled features that were the most recessed demonstrated reduced efficiencies for the OER. The findings from this study emphasize the influences of electrode surface morphology on processes involving electrocatalytic gas evolution.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electrocatalysts for Energy Conversion · Fuel Cells and Related Materials · Advanced battery technologies research

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry, Simon Fraser University, 8888 University Drive, Burnaby, BC V5A 1S6, Canada

Funding

Canada Research Chairs · Natural Sciences and Engineering Research Council of Canada · CMC Microsystems

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