Electron Backscatter Diffraction for Quantitative Evaluation of Copper Surface Cleanliness before Hybrid Bonding
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Abstract
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Research context
OpenAlex topics: Electron and X-Ray Spectroscopy Techniques · Copper Interconnects and Reliability · Corrosion Behavior and Inhibition
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Affiliations
Department of Chemistry, University of California, 9500 Gilman Dr, La Jolla, San Diego, California 92093, United States
Materials Science and Engineering Program, University of California, 9500 Gilman Dr, La Jolla, San Diego, California 92093, United States
Applied Materials, Inc. 8 Upper Changi Road North, Singapore 506906, Singapore
Department of Materials Science and Engineering, MIT, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, United States
Funding
Microelectronics Advanced Research Corporation
References (37)
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