journal article·2026-05-12

Correction to “Room-Temperature High-Performance InP/Si Surface-Activated Wafer Bonding for Electronic-Photonic System Integration Applications”

Changlin Wu, Jieqiong Zhang, Hei Wong, Jun Liu, Xiao Qin, Lichao Wu, Wenhan Bao, Junhui Duan, Bo Zhao, Anli Yang, Xu Chen

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OpenAlex topics: Photonic and Optical Devices · 3D IC and TSV technologies · Semiconductor Lasers and Optical Devices

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