journal article·2024-07-23Open access

Moisture Diffusion in PECVD a-SiOxNy:H and a-SiOx:H Coated on Polymer Resins: A Neutron Reflectometry Study

Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon

Abstract

High Resolution Image Download MS PowerPoint Slide The uptake of water of as-deposited thin films of SiO x N y and SiO x hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiO x N y -resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D 2 O atmosphere confirms that D 2 O was nonreversibly absorbed in the SiO x N y -resin, but only limited moisture diffusion was observed in the SiO x -resin.
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Research context

OpenAlex topics: Thin-Film Transistor Technologies · Advancements in Photolithography Techniques · Silicon and Solar Cell Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

STMicroelectronics, 38920 Crolles, France

Institut Laue-Langevin, 38042 Grenoble Cedex 9, France

Department of Physics and Astronomy, Uppsala University, 75120 Uppsala, Sweden

Funding

Agence Nationale de la Recherche · Vetenskapsr?det

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