Mitigation of whisker growth by improving the creep properties of Sn coating with bismuth
Source abstract
Abstract
Bismuth has been proved a promising lead-free element that can mitigate whisker growth on Sn coatings. It is generally believed that the formation of the equiaxed crystal structure of Sn–Bi coating helps to relax the compressive stress uniformly. In this study, the Sn–xBi coatings with the columnar structure were prepared on the Al substrate. The addition of Bi promoted the whisker nucleation on the coatings but effectively mitigated the growth of whiskers. The density of geometrically necessary dislocations increased with the increase in Bi content, resulting in a high whisker density on the coatings. The reason why Bi inhibited whisker growth was proposed from the perspective of creep properties of the Sn–xBi coatings. The solution strengthening of Bi in Sn improved the creep resistance of the coatings. The creep stress exponent measured by nanoindentation indicated that the creep mechanism of the Sn–xBi coatings is dislocation climbing. The improvement of creep resistance led to insufficient dislocations in the coating leading to the limitation of Sn atomic diffusion for whisker growth.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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