Kinetics of intermetallic phase growth and determination of diffusion coefficients in solid–solid-state reaction between Cu and (Sn+1at.%Ni) pads
Source abstract
Abstract
The influence of nickel addition to tin substrate on microstructure, kinetics parameters as well as diffusion coefficients was studied on Cu/Sn diffusion couples. The results revealed that the presence of nickel did not affect the growth of Cu3Sn phase in comparison with that of the binary Cu/Sn diffusion couple. However, it substantially influenced the morphology and chemical composition of the (Cu1−xNix)6Sn5 phase, which grew with dual morphology and different chemical composition. The layer of the phase was poorer in nickel, whereas detached grains were richer in nickel concentration. The calculated kinetic parameters showed that the growth of the Cu3Sn and Ni-poor (Cu1−xNix)6Sn5 phases was controlled by volume diffusion, but in the case of Ni-rich (Cu1−xNix)6Sn5 phase, the growth was controlled by a complex mechanism. The calculations of diffusion coefficients and activation energies of Cu3Sn and Ni-poor (Cu1−xNix)6Sn5 phases revealed that the presence of nickel in the tin substrate did not affect the rate of formation/growth of those phases in comparison with the binary Cu/Sn diffusion couples.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (34)
Show source-provided references
1. Chakrabarti DJ, Laughlin DE, Chen SW, Chang YA (1991) Phase Diagrams of Binary Nickel Alloys. ASM International, Materials Park
2. Massalski TB, Okamoto H, Subramanian PR, Kacprzak L (1991) Binary Alloy Phase Diagrams. ASM International, Materials Park
3. Saunders N, Miodownik AP (1990) The Cu–Sn (copper–tin) system. Bull Alloy Phase Diagr 11:278–28710.1007/BF03029299 ↗
4. Schmetterer C, Flandorfer H, Richter KW, Saeed U, Kauffman M, Roussel P, Ipser H (2007) A new investigation of the system Ni–Sn. Intermetallics 15:869–88410.1016/j.intermet.2006.10.045 ↗
5. Nash A, Nash P (1985) The Ni-Sn (Nickel-Tin) System. Bull Alloy Phase Diagr 6:350–35910.1007/BF02880521 ↗
6. Ghosh G (1999) Thermodynamic modeling of the nickel-lead-tin system. Metall Mater Trans 30A:1481–149410.1007/s11661-999-0085-x ↗
7. Liu HS, Wang J, Jin ZP (2005) Thermodynamic optimization of the Ni–Sn binary system. Calphad 28:363–370
8. Huber Z, Wojewoda-Budka J, Wierzbicka-Miernik A, Sypien A, Szczerba M, Zieba P (2016) Influence of phosphorous content on microstructure development at the Ni-P plating/SAC interface. Electron Mater Lett 12:178–18510.1007/s13391-015-5095-9 ↗
9. Liu B, Tian Y, Liu W, Wu W, Wang C (2016) TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows. Mater Lett 163:254–25710.1016/j.matlet.2015.10.108 ↗
10. Tseng Ch-F, Duh J-G (2013) Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint. Mat Sci Eng A 580:169–17410.1016/j.msea.2013.05.058 ↗
11. Lin HM, Ho CY, Chen WL, Wu YH, Wang DH, Lin JR, Wu YH, Hong HC, Lin ZW, Duh JG (2015) Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test. Microelectron Reliab 55:231–23710.1016/j.microrel.2014.09.003 ↗
12. Cogan SF, Kwon S, Klein JD, Rose RM (1984) Diffusion in the CuSn binary system: application to Nb3Sn composites. J Mater Sci 19:497–50010.1007/BF02403236 ↗
13. Xia Y, Xie X, Xie X, Lu C (2006) Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging. J Mater Sci 41:2359–2364. doi: 10.1007/s10853-006-4501-y10.1007/s10853-006-4501-y ↗
14. Lee YG, Duh JG (1998) Characterizing the formation and growth of intermetallic compound in the solder joint. J Mater Sci 33:5569–557210.1023/A:1004499728840 ↗
15. Wierzbicka-Miernik A, Wojewoda-Budka J, Litynska-Dobrzynska L, Kodentsov A, Zieba P (2012) Morphology and chemical composition of Cu/Sn/Cu and Cu(5at%Ni)/Sn/Cu(5at%Ni) interconnections. Sci Technol Weld Joi 17:32–3510.1179/1362171811Y.0000000075 ↗
16. Paul A (2004) The Kirkendall effect in solid state diffusion, PhD Dissertation, Eindhoven University of Technology
17. Wierzbicka-Miernik A, Miernik K, Wojewoda-Budka J, Szyszkiewicz K, Filipek R, Litynska-Dobrzynska L, Kodentsov A, Zieba P (2013) Growth kinetics of the intermetallic phase in diffusion-soldered (Cu-5at.%Ni)/Sn/(Cu-5at.%Ni) interconnections. Mater Chem Phys 142:682–68510.1016/j.matchemphys.2013.08.022 ↗
18. Wang YW, Chang CC, Kao CR (2009) Thermodynamic Optimization of the Ni-Sn Binary System. J Alloys Compd 478:L1–L410.1016/j.jallcom.2008.11.027 ↗
19. Romanow P (2007) Microstructural and kinetic characterization of the Ag/Sn/Ag and Ag/In/Ag joints, obtained by low-temperature diffusion soldering, Master Thesis, Institute of Materials Engineering, Cracow University of Technology (in Polish)
20. Web site: http://rsbweb.nih.gov/ij/
21. Wierzbicka-Miernik A, Miernik K, Wojewoda-Budka J, Litynska-Dobrzynska L, Garzel G (2015) Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn, Ni) diffusion couples with various Ni additions. Intermetallics 59:23–3110.1016/j.intermet.2014.12.001 ↗
22. Dinsdale AT, Watson A, Kroupa A, Vrestal J, Zemanova A, Vizdal J, Version 3.1 of the “COST531” Database for the lead-free solders
23. Wierzbicka-Miernik A, Wojewoda-Budka J, Miernik K, Litynska-Dobrzynska L, Schell N (2017) Characteristics of intermetallic phases in Cu/(Sn, Ni) diffusion couples annealed at 220 °C. J Alloys Compd 693:1102–110810.1016/j.jallcom.2016.09.147 ↗
24. Nakayama M, Kajihara M (2014) Kinetics of solid-state reactive diffusion in the (SnNi)/Cu system. Mater Trans 55:1266–127310.2320/matertrans.M2014038 ↗
25. Tang W, He A, Liu Q, Ivey DG (2010) Solid state interfacial reactions in electrodeposited Cu/Sn couples. Trans Nonferrous Met Soc China 20:90–9610.1016/S1003-6326(09)60102-3 ↗
26. Yuan Y, Guan Y, Li D, Moelans N (2016) Investigation of diffusion behavior in Cu/Sn solid state diffusion couples. J Alloys Compd 661:282–29310.1016/j.jallcom.2015.11.214 ↗
27. Crank J (1987) Free and Moving Boundary Problems. Oxford University Press, Oxford
28. Gupta SC (2003) The stefan problem; basic concepts, modelling and analysis. Elsevier, Amsterdam
29. Fick AE (1855) Uber Diffusion. Prog Ann 94:59–86
30. Darken LS (1948) Diffusion, mobility and their interrelation through free energy in binary metallic systems. Trans AIME 175:184–201
31. Hairer E, Norsett SP, Wanner G (1993) Solving ordinary differential equations I; Nonstiff problems, 2nd edn. Springer, Berlin
32. Onishi M, Fujibuchi H (1975) Reaction-diffusion in the Cu–Sn system. Trans Jpn Inst Met 16:539–54710.2320/matertrans1960.16.539 ↗
33. Paul A, Ghosh C, Boettinger WJ (2011) Diffusion Parameters and growth mechanism of phases in the Cu-Sn system. Metall Mater Trans A 42A:953–963
34. Kumar S, Handwerker CA, Dayananda MA (2011) Intrinsic and interdiffusion in Cu-Sn system. J Phase Equilib Diff 32:309–31910.1007/s11669-011-9907-9 ↗