Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Adhesion, Friction, and Surface Interactions · Copper Interconnects and Reliability
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References (10)
Show source-provided references
1. F. G. Arrieta andD. T. Gawne,J. Mater. Sci. 21 (1986) 1793.10.1007/BF01114741 ↗
2. L. S. Goldman,IBM J. Res. Develop. 13 (1969) 251.10.1147/rd.133.0251 ↗
3. C. G. Woychik andR. C. Sanger, in ”Principles of Electronic Packaging”, edited by D. P. Seraphim, R. Lasky and C. Y. Li (McGraw Hill, New York, 1989) p. 591.
4. L. J. Matienzo andR. W. Snyder, unpublished results (1988).
5. H. H. Manko, in “Solders and Soldering” (McGraw Hill, New York, 1979) p. 199.
6. P. G. Fox, G. Lewis andP. J. Boden,Corrosion Sci. 19 (1979) 457.10.1016/S0010-938X(79)80052-9 ↗
7. H. Ishida andR. Johnson,ibid. 26 (1986) 657.10.1016/0010-938X(86)90031-4 ↗
8. M. Bakszt, in “Printed Circuit World Convention III”, Proceedings, WCIII-4, Washington D.C., 22 to 25 May (1984) (Institute of Interconnecting and Packaging Electronic Circuits, Evanston, Illinois, 1984) p. 2.
9. R. F. Roberts,Surf. Interface Anal. 7 (1985) 88.10.1002/sia.740070206 ↗
10. R. W. Woodgate, “Handbook of Machine Soldering” (Wiley, New York, 1983) p. 3.