Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics

This work is aimed at studying the fundamentals ensuring the formation of high-quality functional printed copper layers at low temperatures. The paper describes the decomposition of copper formate and its ligand-based complexes: ammonia, ethylamine, diethylamine, and pyridine. Structural and thermal features of the samples were studied by differential thermal analysis, thermogravimetric analysis, and X-ray diffraction analysis. Based on the results of experimental data and quantum-chemical calculations as well, the main features of the reactions of decomposition of the studied samples have been proposed. Aspects of the main factors reducing the decomposition temperature of complex compounds have been identified and described. Based on the results of the study, a self-consistent model which describes the limits of the existing models of the decomposition process of copper formate and its complex compounds is proposed in the work.