Creep and microstructure in powder metallurgy 15 vol.% SiCp–2009 Al composite

The creep behavior and microstructure of powder metallurgy (PM) 15 vol.% silicon particulate-reinforced 2009 aluminum alloy (SiCp–2009 Al composite) and its matrix PM 2009 Al were investigated over six orders of magnitude of strain rate and at temperatures in the range 618–678 K. The results show that the creep behavior of PM 15% SiCp–2009 Al composite resembles that of PM 2009 Al with regard to (a) the variations in both the apparent stress exponent and the apparent activation energy for creep due to applied stress, (b) the value of the true stress exponent, (c) the value of the true activation energy for creep, (d) the interpretation of creep in terms of a threshold stress, and (e) the temperature dependence of threshold stress. This resemblance implies that deformation in the matrix governs deformation in the composite. Analysis of the creep data in terms of creep rate against an effective stress shows that the creep behaviors of the composite and unreinforced alloy are consistent with the operation of viscous glide creep at low stresses. A comparison between the creep data of the composite and those of the unreinforced matrix revealed that the composite exhibited more creep-resistant characteristics than its matrix over the entire range of applied stresses.