journal article·1986-07

Solid-state diffusion bonding of tungsten-25 rhenium alloy

T. G. Nieh

Journal of Materials Science· Volume 21· Issue 7
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Abstract

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Research context

OpenAlex topics: Advanced materials and composites · Intermetallics and Advanced Alloy Properties · High Temperature Alloys and Creep

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References (11)

Show source-provided references
1. B. W. Gonser (ed.), ?Rhenium? (Elsevier, Amsterdam-New York, 1962).
2. W. D. Klopp, W. R. Witzke andP. L. Raffo, NASA-TN-D-3483, September (1966).
3. F. A. Lowenheim (ed.), ?Modern Electroplating?, 3rd Edn (Wiley, New York, 1974) p. 625.
4. L. J. Durney (ed.), ?Electroplating Engineering Handbook?, 4th Edn (Van Nostrand Reinhold, New York, 1984) p. 233.
5. A. Y. Kandeil, J-P. A. Immarigeon, W. Wallace andM. C. deMalherbe,Met. Trans. 15A (1984) 501.10.1007/BF02644974 ↗
6. T. G. Nieh,Scripta Metall. 18 (1985) 1279.10.1016/0036-9748(84)90122-4 ↗
7. R. P. Elliott, ?Constitution of Binary Alloys, First Supplement? (McGraw-Hill, New York, 1965) p. 666.
8. W. Friedman andT. Brett,Trans. TMS-AIME 242 (1968) 2121.
9. R. H. Jones,Met. Trans. 8A (1977) 378.10.1007/BF02661658 ↗
10. S. Ochiai, Y. Irie, K. Osamura andY. Murakami,Z. Metallkde 74 (1983) 44.
11. S. Ochiai andY. Murakami,Met. Trans. 12A (1981) 1155.10.1007/BF02642329 ↗