Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

This paper presents some experimental observations relative to the influence of elevated current densities on the intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints. Three samples were stressed with different current densities of 104, 1.2 × 104, and 1.4 × 104 A/cm2, respectively, for 80 h. The abnormal polarity effect of electromigration (EM) on chemical reactions at the cathode and the anode was investigated as well as the effect of EM on phase segregation in the two-phase eutectic microstructure. Results indicate that electric current enhances the growth of IMC layer at the cathode and retards it at the anode due to the Bi accumulation acting as a barrier layer with current density of 104 A/cm2. However, when current density increases, the electrical force dissolves the IMC at the cathode into the solder. More and more intermetallic precipitates formed due to the dissolution of Cu into the solder at the cathode side with increased current densities, leading to a very different morphology at the anode and the cathode interfaces, one being planar and the other being very irregular. It can be concluded that the chemical force and the electrical force are the main driving forces contributing to the IMC growth at both interfaces.