The effect of temperature and humidity on interdiffusion of gold and titanium in thin films

journal article·1979-04

W. D. Sylwestrowicz, H. A. Elkholy, G. W. Kammlott

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · Metal and Thin Film Mechanics

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1. J. W. Mayer, J. M. Poate and King-Ning Tu, Science 190 (1975) 228.10.1126/science.190.4211.228 ↗

2. J. M. Poate, P. A. Turner, W. J. De Bonte and J. Yahalom, J. Appl. Phys. 46 (1975) 4275.10.1063/1.321411 ↗

3. A. Christou, L. Jarvis, W. H. Weisenberger and J. K. Hirvonen, J. Electron. Mater. 4 (1975) 329.10.1007/BF02655409 ↗

4. W. D. Sylwestrowicz, J. Electrochem. Soc. 122 (1975) 1504.10.1149/1.2134053 ↗