journal article·1992-10

Internal oxidation of rapidly solidified silver-tin-indium alloy powders

A. Verma, T. R. Anantharaman

Journal of Materials Science· Volume 27· Issue 20
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Electrical Contact Performance and Analysis · Electronic Packaging and Soldering Technologies · Electrodeposition and Electroless Coatings

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References (13)

Show source-provided references
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6. T. R. Anantharaman and C. Suryanarayana, “Rapidly Solidified Metals — A Technological overview” (Trans. Tech, Aedermannsdorf, Switzerland, 1987).10.4028/b-uPTE08 ↗
7. Y. S. Shen and L. J. Gould, IEEE Trans. CHMT-4 (1987) 157.
8. A. Verma and T. R. Anantharaman, Bull Mater. Sci. 14 (1991) 1.10.1007/BF02745084 ↗
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10. J. Rodway Mackert Jr., Metall Trans. 17A (1986) 746.10.1007/BF02644001 ↗
11. A. Verma, A. Roy and T. R. Anantharaman, Int. J. Powder Metall. 27(1) (1991) 51.
12. J. E. Sheeman, F. V. Lenel and G. S. Ansell, Mater. Sci. Res. C (1972) 201.
13. Y. S. Shen, E. J. Zdanuk and R. H. Krock, in “Proceedings of the Sixth International Conference on Electrical Contact Phenomena”, Chicago (1972) p. 333.