DataVXJournal of Materials SciencePaper
journal article·1998-12

Characterizing the formation and growth of intermetallic compound in the solder joint

Y. G. LEE, J. G. DUH

Journal of Materials Science· Volume 33· Issue 23
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Welding Techniques Analysis · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (20)

Show source-provided references
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12. C. C. Young, MS. Dissertation, National Tsing Hua University, Taiwan, Republic of China (1996).
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19. W. Jost, in “Diffusion in Solids, Liquids, Gases” 3rd Ed. (Academic Press, New York, 1960) p. 71.
20. M. G. Pecht, in “Soldering Processes and Equipment” (John Wiley & Sons, Inc., New York, USA, 1993) Chap. 1.