Creep deformation behavior of Sn–Zn solder alloys
Source abstract
Abstract
Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50–75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Forming · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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