The mechanical behaviour of polyimide-copper laminates
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Mechanical Behavior of Composites · Material Properties and Processing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (6)
Show source-provided references
1. C. F. COOMBS Jr., “Printed Circuits Handbook”, 2nd edn (McGraw-Hill, New York, 1979) Chaps 24 and 25.
2. J. GOLDBERG, “How to Make Printed Circuit Boards” (McGraw-Hill, New York, 1980).
3. American Society for Testing and Materials, “Standard Specification for Copper Clad Thermosetting Laminates for Printed Wiring”, D1867-68, 1972, pp. 484–491.
4. A. J. KINLOCH and M. L. YUEN, to be published.
5. A. J. KINLOCH, “Adhesion and Adhesives: Science and Technology” (Chapman and Hall, London, 1987) p. 317.10.1007/978-94-015-7764-9 ↗
6. A. J. KINLOCH, D. MAXWELL and R. J. YOUNG,J. Mater. Sci. Lett. 4 (1985) 1276.10.1007/BF00723480 ↗