journal article·2022-11-22

A Polymeric Planarization Strategy for Versatile Multiterminal Electrical Transport Studies on Small, Bulk Crystals

Huandong Chen, Amir Avishai, Mythili Surendran, Jayakanth Ravichandran

ACS Applied Electronic Materials· Volume 4· Issue 11
Publisher page

Abstract

We report a device fabrication strategy of making multiterminal electrical contacts on small (<1 mm) bulk materials using lithography-based techniques for electrical transport studies. The crystals are embedded in a polymeric medium to planarize the top surface, and then standard lithography and microfabrication techniques are directly applied to form electrodes with various geometries. This approach overcomes the limitations of crystal thickness and lateral dimensions on establishing electrical contacts. We use low-stress polymers to minimize the extrinsic thermal strain effect at low temperatures, which allow reliable transport measurements on quantum materials that are sensitive to strain. The crystal surface planarization method has enabled electronic transport studies such as in-plane anisotropy and Hall measurements on small, bulk BaTiS3 (BTS) crystals and provides unique opportunities for two-dimensional (2D) heterogeneous integration on three-dimensional (3D)/quasi-one-dimensional (quasi-1D) bulk materials. Our strategy is general for many small, nonexfoliable crystals and paves the way for performing versatile transport studies on those materials.
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Research context

OpenAlex topics: Electronic and Structural Properties of Oxides · 2D Materials and Applications · Topological Materials and Phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States

Core Center for Excellence in Nano Imaging, University of Southern California, Los Angeles, California 90089, United States

Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States

Funding

Army Research Office · Division of Materials Research

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