Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions
Source abstract
Abstract
Contact angles on copper substrate of Bi–Ag–Sn and Bi–Ag–Zn ternary alloys containing 3, 6, and 9 at.% of Sn and Zn, respectively, were studied with the sessile drop method. Wetting tests were carried out at 573 and 603 K with or without the use of a flux. Without the flux, the examined alloys do not wet copper, i.e., the observed contact angles are higher than 90°. However, in the presence of the flux wetting of copper is observed. In the case of alloys with Sn, the contact angles decrease with increasing content of Sn, while in the case of alloys with Zn no such tendency is observed. Solidified solder–substrate couples were cross-sectioned and examined with scanning electron microscopy coupled with electron dispersive X-ray analysis.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Thermodynamic and Structural Properties of Metals and Alloys
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (32)
Show source-provided references
1. Moser Z, Gąsior W, Pstruś J (2001) J Phase Equilib 22:25410.1361/105497101770338734 ↗
2. Moser Z, Gąsior W, Pstruś J, Zakulski W, Ohnuma I, Liu XJ, Inohana Y, Ishida K (2001) J Electron Mater 30:112010.1007/s11664-001-0138-4 ↗
3. Moser Z, Gąsior W, Pstruś J (2001) J Electron Mater 30:110410.1007/s11664-001-0136-6 ↗
4. Gąsior W, Moser Z, Pstruś J, Krzyżak B, Fitzner K (2003) J Phase Equilib 24:2110.1007/s11669-003-0005-5 ↗
5. Gąsior W, Moser Z, Pstruś J (2003) J Phase Equilib 24:50410.1361/105497103772084543 ↗
6. Pstruś J, Moser Z, Gąsior W, Dębski A (2006) Arch Metall Mater 51:335
7. Liu XJ, Inohana Y, Ohnuma I, Kainuma R, Ishida K, Moser Z, Gąsior W, Pstruś J (2002) J Electron Mater 31:113910.1007/s11664-002-0003-0 ↗
8. Moser Z, Gąsior W, Pstruś J, Ishida K, Ohnuma I, Kainuma R, Ishihara S, Liu XJ (2004) Mater Trans 45:65210.2320/matertrans.45.652 ↗
9. Gąsior W, Moser Z, Pstruś J, Bukat K, Kisiel R, Sitek J (2004) J Phase Equilib 25:115
10. Moser Z, Gąsior W, Pstruś J, Ohnuma I, Ishida K (2006) Int J Mater Res (formerly Z Metallkde) 97:36510.3139/146.101225 ↗
11. Kisiel R, Gąsior W, Moser Z, Pstruś J, Bukat K, Sitek J (2004) J Phase Equilib 25:12210.1361/15477030418505 ↗
12. Gasior W, Moser Z, Pstruś (2004) J Arch Metall Mater 49:155
13. Kisiel R, Gąsior W, Moser Z, Pstruś J, Bukat K, Sitek J (2005) Arch Metall Mater 50:1079
14. Moser Z, Gąsior W, Bukat K, Pstruś J, Kisiel R, Sitek J, Ohnuma I (2006) J Phase Equilib Diff 27:133
15. Ohnuma I, Ishida K, Moser Z, Gasior W, Bukat K, Pstruś J, Kisiel R, Sitek J (2006) J Phase Equilib Diff 27:24510.1361/154770306X109791 ↗
16. Kisiel R, Bukat K, Sitek J, Gąsior W, Moser Z, Pstruś J (2007) Global SMT Packag 7:34
17. Moser Z, Gąsior W, Bukat K, Pstruś J, Kisiel R, Sitek J, Ishida K, Ohnuma I (2007) J Phase Equilib Diff 28:43310.1007/s11669-007-9156-0 ↗
18. Bukat K, Sitek J, Kisiel R, Moser Z, Gąsior W, Kościelski M, Pstruś J (2008) Solder Surf Mt Tech 20:910.1108/09540910810902660 ↗
19. Gąsior W (2006) Arch Metall Mater 51:317
20. Moser Z, Gąsior W, Dębski A, Pstruś J (2007) SURDAT—database of lead-free soldering materials. IMMS PAS, ISBN 83 60768 01 03. http://imim.pl/surdat-database
21. Matsumoto T, Nogi K (2008) Annu Rev Mater Res 38:25110.1146/annurev.matsci.38.060407.132448 ↗
22. Song JM, Chuang HY, Wu ZM (2006) J Electron Mater 35:104110.1007/BF02692565 ↗
23. Rettenmayr M, Lambracht P, Kempf B, Graff M (2005) Advance Eng Mater 7:96510.1002/adem.200500124 ↗
24. Song JM, Chuang HY, Wen TX (2007) Metal Mater Trans A 38:137110.1007/s11661-007-9138-1 ↗
25. Song JM, Chuang HY, Wu ZM (2007) J Electron Mater 36:151610.1007/s11664-007-0222-5 ↗
26. Sobczak N, Sobczak J, Nowak R, Kudyba A, Darlak P, Mikulowski B, Wojciechowski A (2005) J Mater Sci 40:2547. doi: 10.1007/s10853-005-1990-z10.1007/s10853-005-1990-z ↗
27. Kim DG, Jang HS, Jung SB (2005) J Mater Sci Mater Electron 16:52310.1007/s10854-005-2727-0 ↗
28. Lee YG, Duh JG (1998) J Mater Sci 33:5569. doi: 10.1023/A:100449972884010.1023/A:1004499728840 ↗
29. Hwang JS (2001) Environmental friendly electronics: lead-free technology. Electrochemical Publications Ltd, ISBN 0 901150 40 1
30. Liu CY, Tu KN (1998) J Mater Res 13:37. doi: 10.1557/JMR.1998.000610.1557/JMR.1998.0006 ↗
31. Wang HQ, Ma X, Gao F, Qian YY (2006) Mater Chem Phys 99:20210.1016/j.matchemphys.2005.10.007 ↗
32. Baker H et al (ed) (1990) Alloy phase diagrams, ASM handbook, vol 3. ASM International, ISBN 0 87170 381 5