Novel interpenetrating Cu–Al2O3 structures by controlled reduction of bulk CuAlO2
Source abstract
Abstract
Bulk CuAlO2 with the delafossite structure was processed using two different methods. In one case, stoichiometric CuAlO2 powder was processed using the solution technique, and consolidation was carried out by pressureless sintering in air. In the second case, high purity starting powders of alumina and copper (I) oxide were consolidated by spark plasma sintering. The sintered body was then subjected to a high temperature anneal in air. Reduction of the bulk CuAlO2 samples resulted in a novel composite microstructure with copper forming a continuous intergranular phase. The prior CuAlO2 grains decomposed into an intimate two-phase mixture of metallic copper and θ-alumina. The scale of the composite structures ranged from nanometers to microns. Previous work on the delafossite family has focused primarily on the electronic properties of thin films. The present study suggests that the reduction of this class of mixed oxides gives rise to metal–ceramic structures with unique interfacial and morphological properties.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper-based nanomaterials and applications · Nanomaterials for catalytic reactions · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (46)
Show source-provided references
1. Moya JS, Lopez-Esteban S, Pecharroman C (2007) The challenge of ceramic/metal microcomposites and nanocomposites. Prog Mater Sci 52:1017–109010.1016/j.pmatsci.2006.09.003 ↗
2. Matthews FL, Rawlings RD (1994) Composite materials: engineering and science. Chapman & Hall, London
3. Ibrahim IA, Mohamed FA, Lavernia EJ (1991) Particulate reinforced metal matrix composites—a review. J Mater Sci 26:1137–1156. doi: 10.1007/BF0054444810.1007/BF00544448 ↗
4. Clegg WJ (1988) A stress analysis of the tensile deformation of metal-matrix composites. Acta Metall 36:2141–214910.1016/0001-6160(88)90315-X ↗
5. Murthy VSR, Daniel BSS, Murty GS (1997) Metal–ceramic composites via in situ methods. J Mat Process Technol 68:132–15510.1016/S0924-0136(96)00020-9 ↗
6. Tjong SC, Ma ZY (2000) Microstructural and mechanical characteristics of in situ metal matrix composites. Mater Sci Eng R 29:49–11310.1016/S0927-796X(00)00024-3 ↗
7. Clegg WJ, Horsfall I, Mason JF, Edwards L (1988) The tensile deformation and fracture of al-“saffil” metal-matrix composites. Acta Metall 36:2151–215910.1016/0001-6160(88)90316-1 ↗
8. Su X, Yeomans J (1996) Microstructure and fracture toughness of nickel particle toughened alumina matrix composites. J Mater Sci 31:875–880. doi: 10.1007/BF0035288510.1007/BF00352885 ↗
9. Dillon SJ, Tang M, Carter WC, Harmer MP (2007) Complexion: a new concept for kinetics engineering in materials science and beyond. Acta Mater 55:6208–621810.1016/j.actamat.2007.07.029 ↗
10. Cantwell PR, Tang M, Dillon SJ, Luo J, Rohrer GS, Harmer MP (2014) Grain boundary complexions. Acta Mater 62:1–4810.1016/j.actamat.2013.07.037 ↗
11. Beraud C, Courbiere M, Esnouf C, Juve D, Treheux D (1989) Study of copper alumina bonding. J Mater Sci 24:4545–4554. doi: 10.1007/BF0054454310.1007/BF00544543 ↗
12. Scheu C, Gao M, Oh SH, Dehm G, Klein S, Tomsia AP, Ruhle M (2006) Bonding at copper-alumina interfaces established by different surface treatments: a critical review. J Mater Sci 41:5161–5168. doi: 10.1007/s10853-006-0073-010.1007/s10853-006-0073-0 ↗
13. Chaklander ACD, Armstrong AM, Misra SK (1968) Interface reactions between metals and ceramics IV, wetting of sapphire by liquid copper–oxygen alloys. J Am Ceram Soc 51:630–63310.1111/j.1151-2916.1968.tb12634.x ↗
14. Saiz E, Cannon RM, Tomsia AP (2008) High temperature wetting and the work of adhesion in metal/oxide systems. Annu Rev Mater Res 38:197–22610.1146/annurev.matsci.38.060407.132443 ↗
15. Diemer M, Neubrand A, Trumble KP, Rodel J (1999) Influence of oxygen partial pressure and oxygen content on the wettability in the copper–oxygen–alumina system. J Am Ceram Soc 82:282510.1111/j.1151-2916.1999.tb02163.x ↗
16. Gonzalez EJ, Trumble KP (1996) Spontaneous infiltration of alumina by copper–oxygen alloys. J Am Ceram Soc 79:114–12010.1111/j.1151-2916.1996.tb07888.x ↗
17. Meier A, Baldwin MD, Chidambaram PR, Edwards GR (1995) The effect of large oxygen additions on the wettability and work of adhesion of copper–oxygen alloys on polycrystalline alumina. Mater Sci Eng A 196:111–11710.1016/0921-5093(94)09685-6 ↗
18. Meier AM, Chidambaram PR, Edwards GR (1995) A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina. J Mater Sci 30:4781–4786. doi: 10.1007/BF0115448510.1007/BF01154485 ↗
19. Bahraini M, Weber L, Narciso J, Mortensen A (2005) Wetting in infiltration of alumina particle preforms with molten copper. J Mater Sci 40:2487–2491. doi: 10.1007/s10853-005-1980-110.1007/s10853-005-1980-1 ↗
20. Shen P, Fujii H, Matsumoto T, Nogi K (2005) Influence of substrate crystallographic orientation on the wettability and adhesion of alpha-Al2O3 single crystals by liquid Al and Cu. J Mater Sci 40:2329–2333. doi: 10.1007/s10853-005-1954-310.1007/s10853-005-1954-3 ↗
21. Kim ST, Kim CH (1992) Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding. J Mater Sci 27:2061–2066. doi: 10.1007/BF0111791810.1007/BF01117918 ↗
22. Farrer JK, Nowell MM (2005) EBSD analysis of solid-state reactions between Al2O3 and Cu2O. Microsc Microanal 11:1780
23. Scheu C, Klein S, Tomsia AP, Rühle M (2002) Chemical reactions and morphological stability at the Cu/Al2O3 interface. J Microsc 208:11–1710.1046/j.1365-2818.2002.01065.x ↗
24. Susnitzky DW, Carter CB (1991) The formation of copper aluminate by solid-state reaction. J Mater Res 6:1958–196310.1557/JMR.1991.1958 ↗
25. Guedes M, Ferreira JMF, Rocha LA, Ferro AC (2011) Vacuum infiltration of copper aluminate by liquid aluminium. Ceram Int 37:3631–363510.1016/j.ceramint.2011.06.022 ↗
26. Ishiguro T, Kitazawa A, Mizutani N, Kato M (1981) Single crystal growth and crystal structure refinement of CuAlO2. J Solid State Chem 40:170–17410.1016/0022-4596(81)90377-7 ↗
27. Marquardt MA, Ashmore NA, Cann DP (2006) Crystal chemistry and electrical properties of the delafossite structure. Thin Solid Films 496:146–15610.1016/j.tsf.2005.08.316 ↗
28. Yi S, Trumble KP, Gaskell DR (1999) Thermodynamic analysis of aluminate stability in the eutectic bonding of copper with alumina. Acta Mater 47:3221–322610.1016/S1359-6454(99)00187-1 ↗
29. Misra SK, Chaklader ACD (1963) The system copper oxide—alumina. J Am Ceram Soc 46:509–50910.1111/j.1151-2916.1963.tb13788.x ↗
30. Jacob KT, Alcock CB (1975) Thermodynamics of CuAlO2 and CuAl2O4 and phase-equilibria in system Cu2O–CuO–Al2O3. J Am Ceram Soc 58:192–19510.1111/j.1151-2916.1975.tb11441.x ↗
31. Ingram BJ, Mason TO, Asahi R, Park KT, Freeman AJ (2001) Electronic structure and small polaron hole transport of copper aluminate. Phys Rev B 64:15511410.1103/PhysRevB.64.155114 ↗
32. Kawazoe H, Yasukawa M, Hyodo H, Kurita M, Yanagi H, Hosono H (1997) P-type electrical condition in transparent thin films of CuAlO2. Nature 389:93910.1038/40087 ↗
33. Reddy AS, Reddy PS, Uthanna S, Rao GM (2006) Characterization of CuAlO2 films prepared by dc reactive magnetron sputtering. J Mater Sci Mater Electron 17:615–620. doi: 10.1007/s10854-006-0007-210.1007/s10854-006-0007-2 ↗
34. Yanagiya S, Nong NV, Xu J, Pryds N (2010) The effect of (Ag, Ni, Zn)-addition on the thermoelectric properties of copper aluminate. Materials 3:318–32810.3390/ma3010318 ↗
35. Yanagiya S, Katayama K, Katayama T (2006) Ag- and Mg-doping effects on the synthesis and electrical properties of CuAlO2 prepared by spark plasma sintering method. ICEE conference paper
36. Epicier T, Esnouf C (1990) HREM study of the chemical nature of twin planes in CuAlO2. Philos Mag Lett 61:285–29110.1080/09500839008206368 ↗
37. Ustundag E, Subramanian R, Vaia R, Dieckmann R, Sass SL (1993) In situ formation of metal–ceramic microstructures including metal–ceramic composites using reduction reactions. Acta Metall Mater 41:2153–216110.1016/0956-7151(93)90385-6 ↗
38. Subramanian R, Ustundag R, Sass SL, Dieckmann R (1995) In-situ formation of metal–ceramic microstructures by partial reduction reactions. Solid State Ion 75:241–25510.1016/0167-2738(94)00148-L ↗
39. Ustundag E, Subramanian R, Dieckmann R, Sass SL (1995) In situ formation of metal–ceramic microstructures in the Ni–Al–O system by partial reduction reactions. Acta Metall Mater 43:383–389
40. Ustundag E, Zhang Z, Stocker ML, Rangaswarmy P, Bourke MAM, Subramanian R, Sickafus KE, Roberts JA, Sass SL (1997) Influence of residual stresses on the evolution of microstructure during the partial reduction of NiAl2O4. Mater Sci Eng A 238(1997):50–6510.1016/S0921-5093(97)00433-4 ↗
41. Handwerker CA, Desmukh UV, Cranmer DC (1990) In: Bhagat RB, Clauer AH, Kumar P, Ritter AM (eds) Metal and ceramic matrix composites: processing, modelling and mechanical behavior, The Minerals, Metals and Materials Society, Anaheim, p 457–465
42. Liou YC, Tsai WC, Lin WY, Lee UR (2008) Synthesis of Ca3Co4O9 and CuAlO2 ceramics of the thermoelectric application using a reaction—sintering process. J Aust Ceram Soc 44:17–22
43. Levin I, Brandon DJ (1998) Metastable alumina polymorphs: crystal structures and transition sequences. J Am Ceram Soc 81:1995–201210.1111/j.1151-2916.1998.tb02581.x ↗
44. Wefers K, Misra C (1987) Oxides and hydroxides of aluminum. ALCOA Laboratories, New York, p 20
45. Odaka A, Yamaguchi T, Fujita T, Taruta S, Kitajima K (2008) Cation dopant effect on phase transformation and microstructural evolution in M2+ -substituted γ-alumina powders. J Mater Sci 43:2713–2720. doi: 10.1007/s10853-008-2485-510.1007/s10853-008-2485-5 ↗
46. Okada K, Hattori A, Taniguchi T, Nukui A, Das RN (2000) Effect of divalent cation additives on the γ-Al2O3-to-α-Al2O3 phase transition. J Am Ceram Soc 83:928–93210.1111/j.1151-2916.2000.tb01296.x ↗