Plating of Ni/c-BN composite film in two steps
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Abstract
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Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Metal and Thin Film Mechanics · Copper Interconnects and Reliability
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References (11)
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3. R. Freudenstein, S. Reinke and W. Kulisch ibid. 97 (1997) 270.10.1016/S0257-8972(97)00211-9 ↗
4. P. Lin, C. Deshpandey, H. J. Doerr, R. F. Bunshah, K. L. Chopra and V. Vankar Thin Solid Films 153 (1987) 487.10.1016/0040-6090(87)90208-2 ↗
5. N. Tanabe and T. Hayashi Diam. Related Mater. 01 (1992) 883.10.1016/0925-9635(92)90129-C ↗
6. S. P. S. Arya and A. D'amico Thin Solid Films 157 (1988) 267.10.1016/0040-6090(88)90008-9 ↗
7. N. K. Shrestha and T. Saji J. Jpn. Colour Mater. Soc. 73 (2000) 227.10.4011/shikizai1937.73.227 ↗
8. N. K. Shrestha, K. Sakurada, M. Masuko and T. Saji Surf. Coat. Technol. 140 (2001) 175.10.1016/S0257-8972(01)01045-3 ↗
9. N. K. Shrestha, I. Miwa and Tetsuo Saji J. Electrochem. Soc. 148 (2001) C106.10.1149/1.1342176 ↗
10. N. K. Shrestha, M. Masuko and T. Saji Wear 254 (2003) 555.10.1016/S0043-1648(03)00138-8 ↗
11. T. Takebe, T. Matsuzaki, N. K. Shrestha and T. Saji J. Surf. Fin. Soc. Jpn. 54 (2003) 610.10.4139/sfj.54.610 ↗